摘要散热板在很多电子设备中有很重要的作用。电子设备的高速发展及广泛应用，使得电子舱内的热载荷急剧增加，散热板的作用就是将电子舱内大量的热量传输出去，以免影响电子设备的正常工作。初步发现散热板由于受力不均匀，会出现翘曲等情况。严重影响了散热板的散热性能，因此开展散热板的仿真研究，对于改善散热板的受力状况，解决散热板受力不均的问题，改善了散热板的实用价值，提高了电子设备的使用寿命,有重要的理论意义和工程应用价值。
本文以散热板为研究对象，基于有限元法，采用插件Simulation软件对散热板的加载过程进行分析。建立了散热板的接触模型，探讨了散热板的接触压力分布及其影响因素。计算结果表明，散热板螺钉处过大的加载导致散热板翘曲，散热板接触面积减少和接触压力不均匀；弹性模量对散热板的接触应力影响较大，弹性模量越大，散热板的接触应力越均匀；铝合金散热板厚度越大，应力越趋于均匀。50224
毕业论文关键词：散热板；有限元法；受力均匀；接触应力分布
Abstract The heat cooling plate plays a very important role in many electronic devices. The rapid development and wide application of electronic equipment make heat load of the electronic compartment increase dramatically, the role of the cooling plate is to transfer a lot of heat in the electronic compartment out so not to affect the normal operation of electronic equipment. This article will present a heat cooling plate due to uneven force uniform, affecting warpage, which seriously affects the thermal performance of the heat cooling plate, so carrying out a simulation study of the heat cooling plate is very important. For the force condition for improving the heat cooling plate, solving the uneven force problem of heat cooling plate, to improve the practical value of the heat cooling plate and to improve the use of electronic devices life, which has important theoretical significance and value in engineering.
In this paper, take the heat sink plate as the object and analyse the loading process of the cooling plate based on the finite element method analysis and using Simulation software for. Set up the cooling plate contact model and investigate the distribution of the contact pressure of the cooling plate and its influencing factors. The calculation results show that too large loading the heat radiating plate leads to screw, to reduce the contact area and the contact pressure unevenness in the warpage of the heat cooling plate. For the heat radiating plate, elastic modulus influences the contact pressure, the smaller the elastic modulus, the more uniform contact pressure of the heat cooling plate ; the greater the thickness of the aluminum cooling plate, the more uniform the pressure tends to be.
Keywords: Cooling plate; Finite element method; Uniform force; Contact pressure distribution
目录
第 1 章 绪 论 1
1.1 课题研究背景及意义 1
1.1.1 研究背景 1
1.1.2 研究意义 1
1.2 散热板的选材及应用 2
1.2.1 散热板的选材 2
1.2.2 散热板的应用 5
1.4 本论文研究的主要内容、关键技术问题和方法 电子设备散热底板的接触压力仿真研究+图纸:http://www.751com.cn/jixie/lunwen_53490.html