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微纳结构叠氮化铜的制备及性能研究

时间:2018-05-10 21:19来源:毕业论文
制备的多孔铜表面具有大小不一的孔结构,上层大孔嵌套下层数个小孔形成三维多孔铜沉积层,沉积薄层的厚度约112µm。叠氮化反应过程中没有改变其三维立体结构

摘要本毕业设计围绕微纳结构叠氮化铜的制备及性能表征开展研究,主要内容有:(1)采用适当的微加工方法制备纳米多孔铜薄膜,并对纳米多孔铜薄膜进行结构表征。(2)纳米多孔铜薄膜叠氮化原位化学反应研究,并对纳米多孔铜叠氮化产物的结构、物理、化学性能进行表征。首先采用氢气泡模板法制备多孔铜,然后利用气固反应原理原位合成叠氮化铜。为了保证实验安全,设计了一套用于合成叠氮化铜的反应装置。通过硬脂酸和叠氮化钠反应生成叠氮酸气体,使叠氮酸气体流经多孔铜,原位合成了具有微纳米结构的叠氮化铜。22678
分别采用X射线衍射仪、场发射扫描电镜和激光共聚焦显微镜等对多孔铜和叠氮化产物进行表征。结果表明,制备的多孔铜表面具有大小不一的孔结构,上层大孔嵌套下层数个小孔形成三文多孔铜沉积层,沉积薄层的厚度约112µm。叠氮化反应过程中没有改变其三文立体结构,叠氮化铜具有与多孔铜相同的微米孔径和纳米晶枝结构,其孔壁由分形纳米叠氮化铜晶枝、纳米叠氮化铜棒、纳米叠氮化铜颗粒组成。叠氮化产物中含有叠氮化铜、叠氮化亚铜、氧化亚铜、单质铜,并且发现叠氮化铜的晶型生长方式具有一定的选择性。
采用热重法(TG)、差热分析(DTA)和差示扫描量热法(DSC)对叠氮化铜进行热分析,结果表明,该样品的DSC、DTA曲线中只有一个放热峰,温度大约在210.79℃左右;TG曲线显示,叠氮化铜在194.7℃~207.4℃发生反应并且放热完全,失重达35.1%,说明绝大多数产物发生反应,具有敏感高能的特征,有望在微结构含能器件中得到应用。
关键词:氢气泡模板法 多孔铜 叠氮化铜  表征
毕业论文设计说明书(论文)外文摘要
Title  Preparation and characterization of micro-nano structure of copper azide
Abstract
The preparation and characterization of the copper azide with micro-and nano-structure were researched in this paper and the main contents of the paper are as follows:(1) a nano-porous copper film was prepared using appropriate micromachining method and its structure was characterized; (2) studying the azidation in situ chemical reaction of the nano-porous copper film and the structure, physical and chemical properties of its azide products were characterized.
A porous copper was prepared using hydrogen bubbles evolved from acidic solution containing cupric ions as dynamic templates. Then copper azide was synthesized using gas-solid reaction principles. In order to ensure the safety of the experiment, a suit of reaction apparatus for synthesis copper azide was designed. Hydrazoic acid gas was generated by the reaction of stearic acid and sodium azide and the copper azide with micro and nano structures was synthesized in situ when the hydrazoic acid gas flowing through  the porous copper.
The porous copper and its azide products were characterized using X-ray diffraction, field emission scanning electron microscopy and confocal laser scanning microscopy respectively. The result showed as follows : The surface of the prepared  porous copper had cell structure with different sizes .Three-dimensional porous copper deposited layers was formed by the upper large hole nesting the lower several small holes. The thickness of the deposited thin layer was about 112μm. Azide reaction process didn’t changed its three-dimensional structure and copper azide had the same micron pore size and structure of nanocrystalline sticks as porous copper. The walls of porous copper azide were structured by dendritic copper azide nanofractals, nanorods and nanoparticles. The azide products contained copper azide , cuprous azide, cuprous oxide, elemental copper .The crystal growth pattern of copper azide was found had certain selectivity.
Thermal experiment was carried out on the copper azide using thermal gravimetry (TG), differential thermal analysis (DTA) and differential scanning calorimetry (DSC). The results showed DSC, DTA curve of the sample had only an exothermic peak, a temperature of which was about 210.79 ℃.TG curves showed copper azide reacted and exothermic completely at 194.7 ℃ ~ 207.4 ℃ and weight loss reached 35.1%,which indicating that the majority of products with sensitive high-energy characteristics had reacted and was expected to be used in the micro-structure of energetic devices. 微纳结构叠氮化铜的制备及性能研究:http://www.751com.cn/huaxue/lunwen_15392.html
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